Santra, Sangeeta and Dong, Hongqun and Laurila, Tomi and Paul, Aloke (2014) Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions. In: PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 470 (2161).
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Abstract
A detailed diffusion study was carried out on Cu(Ga) and Cu(Si) solid solutions in order to assess the role of different factors in the behaviour of the diffusing components. The faster diffusing species in the two systems, interdiffusion, intrinsic and impurity diffusion coefficients, are determined to facilitate the discussion. It was found that Cu was more mobile in the Cu-Si system, whereas Ga was the faster diffusing species in the Cu-Ga system. In both systems, the interdiffusion coefficients increased with increasing amount of solute (e.g. Si or Ga) in the matrix (Cu). Impurity diffusion coefficients for Si and Ga in Cu, found out by extrapolating interdiffusion coefficient data to zero composition of the solute, were both higher than the Cu tracer diffusion coefficient. These observed trends in diffusion behaviour could be rationalized by considering: (i) formation energies and concentration of vacancies, (ii) elastic moduli (indicating bond strengths) of the elements and (iii) the interaction parameters and the related thermodynamic factors. In summary, we have shown here that all the factors introduced in this paper should be considered simultaneously to understand interdiffusion in solid solutions. Otherwise, some of the aspects may look unusual or even impossible to explain.
Item Type: | Journal Article |
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Publication: | PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES |
Publisher: | ROYAL SOC |
Additional Information: | Copyright for this article belongs to the ROYAL SOC, ENGLAND |
Keywords: | diffusion; solid solution; driving force; indentation; vacancy wind effect |
Department/Centre: | Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy) |
Date Deposited: | 13 May 2014 07:12 |
Last Modified: | 13 May 2014 07:12 |
URI: | http://eprints.iisc.ac.in/id/eprint/48961 |
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