Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

Huang, Z and Kumar, P and Dutta, I and Sidhu, R and Renavikar, M and Mahajan, R (2014) Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (1). pp. 88-95.

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Abstract

A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer (t (eff)) and the solder yield strength (sigma (ys,eff)) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t (eff), based on the uniform thickness of IMC (t (u)) and the average height of the IMC scallops (t (s)), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t (eff) that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t (eff), mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

Item Type:	Journal Article
Publication:	JOURNAL OF ELECTRONIC MATERIALS
Publisher:	SPRINGER
Additional Information:	Copyright for this article belongs to SPRINGER, USA
Keywords:	Solder joint fracture; fracture mechanism map (FMM); effective thickness of IMC
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	27 Jan 2014 11:05
Last Modified:	27 Jan 2014 11:05
URI:	http://eprints.iisc.ac.in/id/eprint/48254

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