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Comparison of North American universities with and without medical schools and their technology transfer initiatives

Mathew, Mary and Arunagiri, Srigowtham and Nag, Dipanjan (2012) Comparison of North American universities with and without medical schools and their technology transfer initiatives. In: 2012 Proceedings of PICMET '12: Technology Management for Emerging Technologies (PICMET), July 29 2012-Aug. 2 2012, Vancouver, BC, pp. 1684-1691.

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Empirical research available on technology transfer initiatives is either North American or European. Literature over the last two decades shows various research objectives such as identifying the variables to be measured and statistical methods to be used in the context of studying university based technology transfer initiatives. AUTM survey data from years 1996 to 2008 provides insightful patterns about the North American technology transfer initiatives, we use this data in our paper. This paper has three sections namely, a comparison of North American Universities with (n=1129) and without Medical Schools (n=786), an analysis of the top 75th percentile of these samples and a DEA analysis of these samples. We use 20 variables. Researchers have attempted to classify university based technology transfer initiative variables into multi-stages, namely, disclosures, patents and license agreements. Using the same approach, however with minor variations, three stages are defined in this paper. The first stage is to do with inputs from R&D expenditure and outputs namely, invention disclosures. The second stage is to do with invention disclosures being the input and patents issued being the output. The third stage is to do with patents issued as an input and technology transfers as outcomes.

Item Type: Conference Paper
Publisher: IEEE
Additional Information: Copyright of this article belongs to IEEE.
Department/Centre: Division of Interdisciplinary Sciences > Management Studies
Date Deposited: 02 Jul 2013 05:04
Last Modified: 25 Oct 2018 14:31
URI: http://eprints.iisc.ac.in/id/eprint/46804

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