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Polyvinylbutyral based hybrid organic/inorganic films as a moisture barrier material

Gupta, Satyajit and Seethamraju, Sindhu and Ramamurthy, Praveen Chandrashekarapura and Madras, Giridhar (2013) Polyvinylbutyral based hybrid organic/inorganic films as a moisture barrier material. In: Industrial and Engineering Chemistry Research, 52 (12). pp. 4383-4394.

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Official URL: http://dx.doi.org/10.1021/ie3022412


Flexible and thermally stable, freestanding hybrid organic/inorganic based polymer-composite films have been fabricated using a simple solution casting method. Polyvinylbutyral and amine functionalized mesoporous silica were used to synthesize the composite. An additional polyol-''tripentaerythritol''-component was also used to increase the -OH group content in the composite matrix. The moisture permeability of the composites was investigated by following a calcium degradation test protocol. This showed a reduction in the moisture permeability with the increase in functionalized silica loadings in the matrix. A reduction in permeability was observed for the composites as compared to the neat polymer film. The thermal and mechanical properties of these composites were also investigated by various techniques like thermogravimetric analysis, differential scanning calorimetry, tensile experiments, and dynamic mechanical analysis. It was observed that these properties detonate with the increase in the functionalized silica content and hence an optimized loading is required in order to retain critical properties. This deterioration is due to the aggregation of the fillers in the matrix. Furthermore, the films were used to encapsulate P3HT (poly 3 hexyl thiophene) based organic Schottky structured diodes, and the diode characteristics under accelerated aging conditions were studied. The weathered diodes, encapsulated with composite film showed an improvement in the lifetime as compared to neat polymer film. The initial investigation of these films suggests that they can be used as a moisture barrier layer for organic electronics encapsulation application.

Item Type: Journal Article
Publication: Industrial and Engineering Chemistry Research
Publisher: American Chemical Society
Additional Information: Copyright of this article belongs to American Chemical Society.
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 04 Jun 2013 11:49
Last Modified: 04 Jun 2013 11:49
URI: http://eprints.iisc.ac.in/id/eprint/46525

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