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A Model for the Temperature Distribution in Resin Impregnated Paper Bushings

Jyothi, NS and Ramu, TS (2012) A Model for the Temperature Distribution in Resin Impregnated Paper Bushings. In: Asia-Pacific Power and Energy Engineering Conference (APPEEC), MAR 27-29, 2012, Shanghai, PEOPLES R CHINA.

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Official URL: http://dx.doi.org/10.1109/APPEEC.2012.6307302


Resin impregnated paper (RIP) is a relatively new insulation system recommended for the use in transformer bushings. In the recent past, RIP has acquired prominence as insulation in bushings, over conventional oil impregnated paper (OIP), in view of its overwhelming advantages the more important among them being low dielectric loss and possibility for positioning the bushing at any desired angle over the transformer. In addition, the fact that such systems do not pose problems of fire hazard is counted as a very important consideration. The disadvantage of RIP compared to OIP, however, is its much higher cost and involved manufacturing process. The temperature rise in RIP bushings under normal operating conditions is seen to be a difficult parameter to control in view of the limited options for effective cooling. It is therefore essential to take serious note of this aspect, to arrest rapid deterioration of bushing. The degradation of dry-type insulation such as RIP is often due to thermal stress. The long time performance thereof, depends strongly, on the maximum operating temperature. With this in view, the Authors have developed a theoretical model and computational method to study the temperature distribution in the body of insulation. The Authors consider that the basis for the model as being the temperature and electric stress aided AC conductivity. The ensuing heat balance (continuity) equations in 2-D cylindrical geometry are treated as a Dirichelet-Neumann boundary value problem.

Item Type: Conference Paper
Series.: Asia-Pacific Power and Energy Engineering Conference
Publisher: IEEE
Additional Information: Copyright for this article belongs to IEEE, NEW YORK
Keywords: Boundary value problems;conductivity measurement;dielectric thermal factors;epoxy resin impregnated insulation;EHV insulation
Department/Centre: Division of Electrical Sciences > Electrical Engineering
Date Deposited: 07 Feb 2013 11:50
Last Modified: 07 Feb 2013 11:50
URI: http://eprints.iisc.ac.in/id/eprint/45748

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