Diffusion mechanism in the gold-copper system

Ravi, R and Paul, A (2012) Diffusion mechanism in the gold-copper system. In: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 23 (12). pp. 2152-2156.

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Abstract

Interdiffusion study is conducted in the Au-Cu system, which has complete solid solution in the higher temperature range and ordered phases in the lower temperature range. First experiments are conducted at higher temperatures, where atoms can diffuse randomly. Higher values of interdiffusion coefficients are found in the range of 40-50 at.% Cu. This trend is explained with the help of thermodynamic factor and possible concentration of vacancies. Following an experiment is conducted at 623 K (350 degrees C), where the ordered phases are grown. The interdiffusion coefficients at this temperature are compared after extrapolating the data calculated at higher temperatures.

Item Type:	Journal Article
Publication:	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Publisher:	SPRINGER
Additional Information:	Copyright for this article belongs to Pringer
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	21 Dec 2012 04:03
Last Modified:	21 Dec 2012 04:03
URI:	http://eprints.iisc.ac.in/id/eprint/45536

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