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Analytical Solution of Joule-Heating Equation for Metallic Single-Walled Carbon Nanotube Interconnects

Verma, Rekha and Bhattacharya, Sitangshu and Mahapatra, Santanu (2011) Analytical Solution of Joule-Heating Equation for Metallic Single-Walled Carbon Nanotube Interconnects. In: IEEE Transactions on Electron Devices, 58 (11). pp. 3991-3996.

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In this paper, we address a closed-form analytical solution of the Joule-heating equation for metallic single-walled carbon nanotubes (SWCNTs). Temperature-dependent thermal conductivity kappa has been considered on the basis of second-order three-phonon Umklapp, mass difference, and boundary scattering phenomena. It is found that kappa, in case of pure SWCNT, leads to a low rising in the temperature profile along the via length. However, in an impure SWCNT, kappa reduces due to the presence of mass difference scattering, which significantly elevates the temperature. With an increase in impurity, there is a significant shift of the hot spot location toward the higher temperature end point contact. Our analytical model, as presented in this study, agrees well with the numerical solution and can be treated as a method for obtaining an accurate analysis of the temperature profile along the CNT-based interconnects.

Item Type: Journal Article
Publication: IEEE Transactions on Electron Devices
Publisher: IEEE
Additional Information: Copyright 2011 IEEE. Personal use of this material is permitted.However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Keywords: Carbon nanotubes;interconnects;Joule heating;thermal conductivity
Department/Centre: Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology)
Date Deposited: 23 Nov 2011 10:39
Last Modified: 23 Nov 2011 10:39
URI: http://eprints.iisc.ac.in/id/eprint/42278

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