Thermal conductance across oxygen-free high-conductivity copper contacts in different environments

Kshirsagar, B and Nagaraju, J and Murthy, MVK (2003) Thermal conductance across oxygen-free high-conductivity copper contacts in different environments. In: Journal of Thermophysics and Heat Transfer, 17 (4). pp. 540-542.

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Abstract

When two metallic surfaces are brought into contact to transmit heat, the uniform flow of heat is restricted to conduction through the contact spots. This paper discusses the study of the variation in thermal conductance across oxygen-free high-conductivity (OFHC) copper contacts in vacuum nitrogen, and helium environments.

Item Type:	Journal Article
Publication:	Journal of Thermophysics and Heat Transfer
Publisher:	American Institute of Aeronautics and Astronautics
Additional Information:	Copyright of this article belongs to American Institute of Aeronautics and Astronautics.
Department/Centre:	Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics
Date Deposited:	25 Aug 2011 04:43
Last Modified:	23 Jul 2019 06:42
URI:	http://eprints.iisc.ac.in/id/eprint/40288

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