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Downward Laser Trimming of Thick Film Resistors

Narayana, Badri T and Ramkumar, K and Satyam, M (1991) Downward Laser Trimming of Thick Film Resistors. In: IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 14 (4). pp. 894-899.


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In this paper a method of laser trimming thick film resistors to lower resistance, that is downwards, is suggested. It involves heating of certain regions of the resistor film in the form of tracks (to a temperature where certain transformation in the structure of the film takes place, like segregation of the constituents of the resistor material, but not high enough to evaporate the material) by the use of a laser beam of appropriate power density. The heated regions are found to become regions of very high electrical conductivity. It has been found that trimming tracks made perpendicular to the current flow direction are not effective in reducing the resistance. On the other hand, trimming tracks made along the direction of the current flow are found to be effective in decreasing the value of the resistance. It has also been found that the resistance decreases with an increase in length and width of the track. This paper provides data from computer simulations and measurements made on analog resistor networks that enable one to design trimming tracks.

Item Type: Journal Article
Publication: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Publisher: IEEE
Additional Information: �©1990 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Department/Centre: Division of Electrical Sciences > Electrical Communication Engineering
Date Deposited: 11 Nov 2005
Last Modified: 19 Sep 2010 04:21
URI: http://eprints.iisc.ac.in/id/eprint/3981

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