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Nonlinear analysis of adhesively bonded lap joints considering viscoplasticity in adhesives

Pandey, PC and Shankaragouda, H and Singh, Arbind Kr (1999) Nonlinear analysis of adhesively bonded lap joints considering viscoplasticity in adhesives. In: Computers & Structures, 70 (4). 387-413 .

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Official URL: http://dx.doi.org/10.1016/S0045-7949(98)00168-0

Abstract

This paper presents nonlinear finite element analysis of adhesively bonded joints considering the elastoviscoplastic constitutive model of the adhesive material and the finite rotation of the joint. Though the adherends have been assumed to be linearly elastic, the yielding of the adhesive is represented by a pressure sensitive modified von Mises yield function. The stress-strain relation of the adhesive is represented by the Ramberg-Osgood relation. Geometric nonlinearity due to finite rotation in the joint is accounted for using the Green-Lagrange strain tensor and the second Piola-Kirchhoff stress tensor in a total Lagrangian formulation. Critical time steps have been calculated based on the eigenvalues of the transition matrices of the viscoplastic model of the adhesive. Stability of the viscoplastic solution and time dependent behaviour of the joints are examined. A parametric study has been carried out with particular reference to peel and shear stress along the interface. Critical zones for failure of joints have been identified. The study is of significance in the design of lap joints as well as on the characterization of adhesive strength. (C) 1999 Elsevier Science Ltd. All rights reserved.

Item Type: Journal Article
Publication: Computers & Structures
Publisher: Elsevier Science
Additional Information: Copyright of this article belongs to Elsevier Science.
Keywords: Adhesive;Adherends;Bonded joints;Critical time;Elasto-viscoplasticity;Finite rotation;Nonlinear ®nite element analy-sis;Peel stress;Shear stress
Department/Centre: Division of Mechanical Sciences > Civil Engineering
Date Deposited: 29 Jun 2011 06:19
Last Modified: 29 Jun 2011 06:19
URI: http://eprints.iisc.ac.in/id/eprint/38692

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