Low temperature compressive creep in electrodeposited nanocrystalline nickel

Kottada, Ravi S and Chokshi, Atul H (2005) Low temperature compressive creep in electrodeposited nanocrystalline nickel. In: Scripta Materialia, 53 (8). pp. 887-892.

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Abstract

Steady state creep was not observed during large strain compressive creep in electrodeposited nanocrystalline-Ni. An additional exothermic peak during differential scanning calorimetry of deformed samples is attributed to recovery associated with geometrically necessary dislocations. The lack of change in texture suggests that grain boundary sliding and rotation occurred during creep.

Item Type:	Journal Article
Publication:	Scripta Materialia
Publisher:	Pergamon-Elsevier Science Ltd
Additional Information:	Copyright for this article belongs to Elsevier.
Keywords:	Nanocrystalline;Nickel;Creep;Dislocation;Diffusion
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	05 Oct 2005
Last Modified:	19 Sep 2010 04:20
URI:	http://eprints.iisc.ac.in/id/eprint/3778

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