Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

Paul, A and Ghosh, C and Boettinger, WJ (2011) Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System. In: Metallurgical and Materials Transactions A, 42A (4). pp. 952-963.

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Abstract

The tracer diffusion coefficients of the elements as well as the integrated interdiffusion coefficients are determined for the Cu3Sn and Cu6Sn5 intermetallic compounds using incremental diffusion couples and Kirkendall marker shift measurements. The activation energies are determined for the former between 498 K and 623 K (225 A degrees C and 350 A degrees C) and for the latter between 423 K and 473 K (150 A degrees C and 200 A degrees C). Sn is found to be a slightly faster diffuser in Cu6Sn5, and Cu is found to be the faster diffuser in Cu3Sn. The results from the incremental couples are used to predict the behavior of a Cu/Sn couple where simultaneous growth of both intermetallics occurs. The waviness at the Cu3Sn/Cu6Sn5 interface and possible reasons for not finding Kirkendall markers in both intermetallics in the Cu/Sn couple are discussed.

Item Type:	Journal Article
Publication:	Metallurgical and Materials Transactions A
Publisher:	Springer
Additional Information:	Copyright of this article belongs to Springer.
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	29 Mar 2011 08:09
Last Modified:	29 Mar 2011 08:09
URI:	http://eprints.iisc.ac.in/id/eprint/36341

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