Physics-Based Thermal Conductivity Model for Metallic Single-Walled Carbon Nanotube Interconnects

Bhattacharya, Sitangshu and Amalraj, Rex and Mahapatra, Santanu (2011) Physics-Based Thermal Conductivity Model for Metallic Single-Walled Carbon Nanotube Interconnects. In: IEEE Electron Device Letters, 32 (2). pp. 203-205.

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Abstract

In this letter, a closed-form analytical model for temperature-dependent longitudinal diffusive lattice thermal conductivity (kappa) of a metallic single-walled carbon nanotube (SWCNT) has been addressed. Based on the Debye theory, the second-order three-phonon Umklapp, mass difference (MD), and boundary scatterings have been incorporated to formulate. in both low-and high-temperature regimes. It is proposed that. at low temperature (T) follows the T-3 law and is independent of the second-order three-phonon Umklapp and MD scatterings. The form factor due to MD scattering also plays a key role in the significant variation of. in addition to the SWCNT length. The present diameter-independent model of. agrees well with the available experimental data on suspended intrinsic metallic SWCNTs over a wide range of temperature and can be carried forward for electrothermal analyses of CNT-based interconnects.

Item Type:	Journal Article
Publication:	IEEE Electron Device Letters
Publisher:	IEEE
Additional Information:	Copyright 2011 IEEE. Personal use of this material is permitted.However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Keywords:	Interconnects;nanotubes;phonons;thermal conductivity
Department/Centre:	Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology)
Date Deposited:	07 Apr 2011 10:33
Last Modified:	13 Oct 2011 07:12
URI:	http://eprints.iisc.ac.in/id/eprint/36033

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