Interdiffusion studies in bulk Au-Ti system

Kumar, AK and Paul, A (2010) Interdiffusion studies in bulk Au-Ti system. In: Journal of Materials Science: Materials in Electronics, 21 (11). pp. 1202-1206.

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Abstract

The performance of the contacts, where Au/Ti layers are used in the metallization scheme, largely depends on the product phases grown by interdiffusion at the interface. It is found that four intermetallic compounds grow with narrow homogeneity range and wavy interfaces in the interdiffusion zone. The presence of wavy interfaces is the indication of high anisotropy in diffusion of the product phases. This also reflects in the deviation of parabolic growth from the average. Further, we have determined the relevant diffusion parameters, such as interdiffusion coefficient in the penetrated region of the end members and integrated diffusion coefficients of the intermetallic compounds.

Item Type:	Journal Article
Publication:	Journal of Materials Science: Materials in Electronics
Publisher:	Springer
Additional Information:	Copyright of this article belongs to Springer.
Department/Centre:	Division of Electrical Sciences > Electronic Systems Engineering (Formerly Centre for Electronic Design & Technology) Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	11 Nov 2010 10:52
Last Modified:	11 Nov 2010 10:52
URI:	http://eprints.iisc.ac.in/id/eprint/33657

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