ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Dielectric Properties of Epoxy-Al2O3 Nanocomposite System for Packaging Applications

Singha, Santanu and Thomas, M Joy (2010) Dielectric Properties of Epoxy-Al2O3 Nanocomposite System for Packaging Applications. In: IEEE Transactions on Components and Packaging Technologies, 33 (2). pp. 373-385.

[img] PDF
for.pdf - Published Version
Restricted to Registered users only

Download (1MB) | Request a copy
Official URL: http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumb...


In recent times, there has been an ever-growing need for polymer-based multifunctional materials for electronic packaging applications. In this direction, epoxy-Al2O3 nanocomposites at low filler loadings can provide an excellent material option, especially from the point of view of their dielectric properties. This paper reports the dielectric characteristics for such a system, results of which are observed to be interesting, unique, and advantageous as compared to traditionally used microcomposite systems. Nanocomposites are found to display lower values of permittivity/tan delta over a wide frequency range as compared to that of unfilled epoxy. This surprising observation has been attributed to the interaction between the epoxy chains and the nanoparticles, and in this paper this phenomenon is analyzed using a dual layer interface model reported for polymer nanocomposites. As for the other dielectric properties associated with the nanocomposites, the nano-filler loading seems to have a significant effect. The dc resistivity and ac dielectric strength of the nanocomposites were observed to be lower than that of the unfilled epoxy system at the investigated filler loadings, whereas the electrical discharge resistant properties showed a significant enhancement. Further analysis of the results obtained in this paper shows that the morphology of the interface region and its characteristics decide the observed interesting dielectric behaviors.

Item Type: Journal Article
Publication: IEEE Transactions on Components and Packaging Technologies
Publisher: IEEE
Additional Information: Copyright 2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Keywords: AC dielectric strength; dc resistivity; dielectrics; discharge resistance; epoxy nanocomposites; permittivity; tan delta.
Department/Centre: Division of Electrical Sciences > High Voltage Engineering (merged with EE)
Date Deposited: 18 Oct 2010 07:19
Last Modified: 18 Oct 2010 07:19
URI: http://eprints.iisc.ac.in/id/eprint/33275

Actions (login required)

View Item View Item