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On the low temperature deformation mechanism in polycrystalline cadmium

Sastry, DH and Prasad, YVRK and Vasu, KI (1969) On the low temperature deformation mechanism in polycrystalline cadmium. In: Acta Metallurgica, 17 (12). pp. 1453-1457.

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Official URL: http://dx.doi.org/10.1016/0001-6160(69)90009-1


The thermally activated plastic flow of polycrystalline cadmium was investigated by differentialstress creep tests at 86°K and tensile tests in the temperature range 86°–473°K. The activation energy (0.55 eV) at zero effective stress and the activation volume as a function of effective stress were obtained. It is concluded that intersection of glide and forest dislocations becomes rate controlling for low temperature deformation. The approximate stacking-fault width in cadmium is deduced to be “1.5b”.

Item Type: Journal Article
Publication: Acta Metallurgica
Publisher: Elsevier Science
Additional Information: Copyright of this article belongs to Elsevier Science.
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 18 May 2010 06:01
Last Modified: 19 Sep 2010 06:05
URI: http://eprints.iisc.ac.in/id/eprint/27612

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