On the low temperature deformation mechanism in polycrystalline cadmium

Sastry, DH and Prasad, YVRK and Vasu, KI (1969) On the low temperature deformation mechanism in polycrystalline cadmium. In: Acta Metallurgica, 17 (12). pp. 1453-1457.

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Abstract

The thermally activated plastic flow of polycrystalline cadmium was investigated by differentialstress creep tests at 86°K and tensile tests in the temperature range 86°–473°K. The activation energy (0.55 eV) at zero effective stress and the activation volume as a function of effective stress were obtained. It is concluded that intersection of glide and forest dislocations becomes rate controlling for low temperature deformation. The approximate stacking-fault width in cadmium is deduced to be “1.5b”.

Item Type:	Journal Article
Publication:	Acta Metallurgica
Publisher:	Elsevier Science
Additional Information:	Copyright of this article belongs to Elsevier Science.
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	18 May 2010 06:01
Last Modified:	19 Sep 2010 06:05
URI:	http://eprints.iisc.ac.in/id/eprint/27612

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