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Numerical prediction of load-displacement behaviors of adhesively bonded joints at different extension rates and temperatures

Malvade, I and Deb, A and Biswas, P and Kumar, A (2009) Numerical prediction of load-displacement behaviors of adhesively bonded joints at different extension rates and temperatures. In: Computational Materials Science, 44 (4). pp. 1208-1217.

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The present work focuses on simulation of nonlinear mechanical behaviors of adhesively bonded DLS (double lap shear) joints for variable extension rates and temperatures using the implicit ABAQUS solver. Load-displacement curves of DLS joints at nine combinations of extension rates and environmental temperatures are initially obtained by conducting tensile tests in a UTM. The joint specimens are made from dual phase (DP) steel coupons bonded with a rubber-toughened adhesive. It is shown that the shell-solid model of a DLS joint, in which substrates are modeled with shell elements and adhesive with solid elements, can effectively predict the mechanical behavior of the joint. Exponent Drucker-Prager or Von Mises yield criterion together with nonlinear isotropic hardening is used for the simulation of DLS joint tests. It has been found that at a low temperature (-20 degrees C), both Von Mises and exponent Drucker-Prager criteria give close prediction of experimental load-extension curves. However. at a high temperature (82 degrees C), Von Mises condition tends to yield a perceptibly softer joint behavior, while the corresponding response obtained using exponent Drucker-Prager criterion is much closer to the experimental load-displacement curve.

Item Type: Journal Article
Publication: Computational Materials Science
Publisher: Elsevier Science
Additional Information: Copyright of this article belongs to Elsevier Science.
Keywords: Double lap shear (DLS) joint;Dual phase steel substrate;Epoxy adhesive;Finite element modeling;Temperature;Strain rate
Department/Centre: Division of Mechanical Sciences > Centre for Product Design & Manufacturing
Date Deposited: 13 Nov 2009 08:17
Last Modified: 19 Sep 2010 05:29
URI: http://eprints.iisc.ac.in/id/eprint/19578

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