Rajanna, K and Tanaka, S and Itoh, T and Esashi, M (2004) Reaction bonding of microstructured silicon carbide using polymer and silicon thin film. In: Proceedings of the 10th International Conference on Silicon Carbide and Related Materials 2003, 5-10,2003, Lyon, France.
Full text not available from this repository. (Request a copy)Abstract
We report the successful bonding of microstructured Silicon carbide using the reaction between polymer layer and sputtered silicon thin film. The necessary steps and the process parameters have been optimized. The bonded substrates have been analyzed using optical microscope, SEM/EDX and ESCA. The substrates were also tested for their bond strength. It has been found that optimum combination of silicon film thickness and polymer layer in sandwich configuration is necessary for achieving better bond strength.
| Item Type: | Conference Paper |
|---|---|
| Publisher: | Trans Tech Publications. |
| Additional Information: | Copyright of this article belongs to Trans Tech Publications. |
| Keywords: | reaction bonding;microstructured silicon carbide;reactive ion etching;bond strength measurement;MEMS |
| Department/Centre: | Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics |
| Date Deposited: | 19 Dec 2008 14:41 |
| Last Modified: | 19 Dec 2008 14:41 |
| URI: | http://eprints.iisc.ac.in/id/eprint/17280 |
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