Bhat, KN and Gupta, Das A and Rao, PRS and Gupta, Das N and Bhattacharya, E and Sivakumar, K and Kumar, Vinoth V and Anitha, Helen L and Joseph, JD and Madhavi, SP and Natarajan, K (2007) Wafer bonding - A powerful tool for MEMS. In: Indian Journal of Pure and Applied Physics, 45 (4). pp. 311-316.
Full text not available from this repository. (Request a copy)Abstract
Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS based sensors and actuators. Various silicon wafer bonding techniques and their role on MEMS devices such as pressure sensors, accelerometers and micropump have been discussed. The results on the piezoresistive pressure sensors monolithically integrated with a MOSFET differential amplifier circuit have been presented to demonstrate the important role played by the Silicon Fusion Bonding technique for integration of sensors with electronics on a single chip.
| Item Type: | Journal Article |
|---|---|
| Publication: | Indian Journal of Pure and Applied Physics |
| Publisher: | National Institute of Science Communication and Information Resources |
| Additional Information: | Copyright of this article belongs to National Institute of Science Communication and Information Resources. |
| Department/Centre: | Division of Electrical Sciences > Electrical Communication Engineering |
| Date Deposited: | 16 Oct 2007 |
| Last Modified: | 02 Feb 2012 09:53 |
| URI: | http://eprints.iisc.ac.in/id/eprint/11718 |
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