Radha, TS and Ramprasad, BS (1992) Measurement of the thermal stress in specularly reflecting thin films using real-time holographic interferometry. In: 5th International Symposium on Nondestructive Characterization on Materials, 27-30 May 1991, Karuizawa, Japan, pp. 949-957.
Full text not available from this repository. (Request a copy)Abstract
A method of measurement of thermal stress of thin films using real-time holographic interferometry is described, with particular emphasis on specularly reflecting thin films. A few thin film-substrate systems have been used for the measurements. For the copper film on brass substrate and silver on glass theoretical and experimental results are found to agree reasonably well at different temperatures. For the cases of aluminium film and magnesium fluoride film on glass there is a wide discrepancy. However it is pointed out that experimental values are closer to reality.
| Item Type: | Conference Paper |
|---|---|
| Publisher: | Taylor and Francis Group |
| Additional Information: | Copyright of this article belongs to Taylor and Francis Group. |
| Keywords: | Thermal stress;thin films;holographic interferometry |
| Department/Centre: | Division of Physical & Mathematical Sciences > Instrumentation Appiled Physics |
| Date Deposited: | 11 Jan 2008 |
| Last Modified: | 12 Jan 2012 06:39 |
| URI: | http://eprints.iisc.ac.in/id/eprint/11148 |
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