Ghare, DB and Prakash, S and Oak, S (2000) Utilisation of amorphous semiconductor switching materials for programmable interconnections and circuits. In: 2000 HD International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, Denver, CO, USA, pp. 232-234.
Full text not available from this repository. (Request a copy)Abstract
Several amorphous semiconductor material compositions are well known to exhibit I-V switching characteristics which are useful for numerous applications. The application of thin-thick films of such materials for programmable switching interconnections and circuits is a new area attracting attention around the world. This article presents information on the properties of such material compositions relevant for programmable switching interconnections as well as for buried R/C/L circuit element fabrication along with some results by the authors on chalcogenide based amorphous semiconductor material compositions
Item Type: | Conference Paper |
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Publisher: | IMAPS - International Microelectronics & Packaging Society |
Additional Information: | Copyright of this article belongs to IMAPS - International Microelectronics & Packaging Society |
Keywords: | integrated circuit interconnections;integrated circuit;packaging;multichip modules;programmable circuits;RC circuits;semiconductor device packaging;semiconductor;switches;semiconductor thin films;switching |
Department/Centre: | Division of Electrical Sciences > Electrical Communication Engineering |
Date Deposited: | 27 Jul 2007 |
Last Modified: | 27 Aug 2008 12:43 |
URI: | http://eprints.iisc.ac.in/id/eprint/10357 |
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