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Conference Paper

Varadarajan, Mahesh G and Lee, Kang J and Bhattacharya, Swapan K and Bliattachaijee, Ajanta and Wan, Lixi and Pucha, Raghuram and Tummala, Rao R and Sitaraman, Suresh (2006) Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process. In: th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 06), Jun 27, 2005-Jun 30, 2006, Shanghai, pp. 98-108.