ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Browse by Author

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Number of items: 1.

Conference Paper

Sundaram, Venky and Tummala, Rao and Wiedenman, Boyd and Liu, Fuhan and Raj, Markondeya P and Abothu, Isaac Robin and Bhattacharya, Swapan and Varadarajan, Mahesh and Bongio, Ed and Sherwood, Walt (2006) Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration. In: 2006. Proceedings. 56th Electronic Components and Technology Conference, 2006, San Diego, CA.

This list was generated on Mon Oct 26 16:29:47 2020 IST.