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Number of items: 3.

Journal Article

Somaiah, N and Kumar, P (2020) Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films. In: Journal of Electronic Materials, 49 (1). pp. 96-108.

Somaiah, N and Kanjilal, A and Kumar, P (2020) Effects of an interfacial layer on stress relaxation mechanisms active in the Cu-Si thin film system during thermal cycling. In: MRS Communications, 10 (1). pp. 164-172.

Somaiah, N and Kumar, P (2018) Tuning electromigration-thermomigration coupling in Cu/W Blech structures. In: Journal of Applied Physics, 124 (18).

This list was generated on Fri Mar 29 15:57:36 2024 IST.