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Conference Paper

Sahoo, M and Gope, D and Ambasana, N and Eesha, D and Chandrasekhar, A (2019) Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis. In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, 6 October 2019 through 9 October 2019, McGill University CampusMontreal; Canada.

This list was generated on Fri Oct 23 20:07:18 2020 IST.