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Krishna, Vamsi NP and Sen, Prosenjit (2016) 3D Die Level Packaging for Hybrid Systems. In: IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), MAY 23-26, 2016, San Jose, CA, pp. 120-122.

Chhabra, Priya and Sharma, Anurekha and Krishna, Vamsi NP (2016) Fabrication and characterisation of bulk micromachined ZnO energy transducer with interdigitated electrodes. In: 2nd International Conference on Surfaces, Coatings and Nanostructured Materials - Asia (NANOSMAT-Asia), MAR 24-27, 2015, Kayseri, TURKEY, pp. 1055-1066.

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