Number of items: 2.
Journal Article
Laurila, T and Karppinen, J and Vuorinen, V and Li, J and Paul, A and Paulasto-Krockel, M
(2012)
Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading.
In: Journal of Electronic Materials, 41
(11).
pp. 3179-3195.
Laurila, T and Karppinen, J and Vuorinen, V and Paul, A and Paulasto-Krockel, M
(2011)
Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers.
In: Journal of Electronic Materials, 40
(7).
pp. 1517-1526.
This list was generated on Tue Apr 16 10:38:52 2024 IST.
