|
 | Up a level |
Kanjilal, Anwesha and Narayanan P, Ramesh and Kumar, Praveen (2022) Transition from necking to cavitation driven tertiary creep with length scale in constrained ductile metal joints. In: Materials Science and Engineering: A, 845 . ISSN 09215093
Kanjilal, Anwesha and Kumar, Praveen (2018) Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion. In: JOURNAL OF ELECTRONIC MATERIALS, 47 (1). pp. 457-469.
Kanjilal, Anwesha and Jangid, Vikas and Kumar, Praveen (2017) Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures. In: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 703 . pp. 144-153.
Ghosh, Rituparna and Kanjilal, Anwesha and Kumar, Praveen (2017) Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. In: MICROELECTRONICS RELIABILITY, 74 . pp. 44-51.
