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Journal Article

Kanjilal, Anwesha and Jangid, Vikas and Kumar, Praveen (2017) Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures. In: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 703 . pp. 144-153.

This list was generated on Sun Feb 23 22:43:22 2020 IST.