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Kumar, P and Dutta, I and Huang, Z and Conway, P (2021) Materials and Processing of TSV. [Book Chapter]
Kumar, P and Lee, T-K and Dutta, I and Huang, Z and Conway, P (2021) Microstructure and Mechanical Reliability Issues of TSV. [Book Chapter]
Huang, Z and Kumar, P and Dutta, I and Sidhu, R and Renavikar, M and Mahajan, R (2014) Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (12). pp. 4485-4496.
Huang, Z and Kumar, P and Dutta, I and Sidhu, R and Renavikar, M and Mahajan, R (2014) Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (1). pp. 88-95.
Huang, Z and Kumar, P and Dutta, I and Pang, JHL and Sidhu, R (2014) A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks. In: ENGINEERING FRACTURE MECHANICS, 131 . pp. 9-25.
