Number of items: 2.
Conference Paper
Nittala, PVK and Haridas, K and Sen, P
(2022)
Heterogeneous Integration by the 3D Stacking of Thin Silicon Die.
In: 72nd IEEE Electronic Components and Technology Conference, ECTC 2022, 31 May - 3 June 2022, San Diego, pp. 608-613.
Journal Article
Nittala, PVK and Haridas, K and Nigam, S and Tasneem, S and Sen, P
(2021)
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies.
In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 39
(5).
This list was generated on Wed Apr 24 08:05:45 2024 IST.
