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Govindan, S and Kumar, A and Choi, B and Venkataraman, S and Gope, D (2022) A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 12 (7). pp. 1204-1213.
Madhav, HV and Raghavendra, V and Kumar, P and Ambirajan, A and Dutta, P (2021) Development of a Canister Module for PCM Coupled Heat Pipe in Spacecraft Thermal Management. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (11). pp. 1804-1815.
Govindan, S and Bharath, K and Venkataraman, S and Gope, D (2021) A State-Space-Based Method to Model Vccin Feedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (9). pp. 1391-1401.
Nittala, PVK and Remesh, N and Niranjan, S and Tasneem, S and Raghavan, S and Muralidharan, R and Nath, DN and Sen, P (2020) Enabling Transfer of Ultrathin Layers of GaN for Demonstration of a Heterogenous Stack on Copper Heat Spreader. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (2). pp. 339-342.
Chaudhary, K and Singh, G and Ramkumar, J and Anantha Ramakrishna, S and Srivastava, KV and Ramamurthy, PC (2020) Optically Transparent Protective Coating for ITO-Coated PET-Based Microwave Metamaterial Absorbers. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 378-388.
