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Shukla, A and Nukala, SS and Akash, . and Singh, DK and Gope, D and Hansen, J (2023) Comparison of Surrogate Modeling Approaches for Estimation of EMI Filter Insertion Loss. In: 2023 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2023, 12 December 2023 through 14 December 2023, Hybrid, Rose-Hill.
Gomez, J and Nukala, SS and Gope, D and Hansen, J and Akash, . (2023) Multi-Objective EMI Optimisation using a Metamodel-based SiC/GaN Converter and NSGA II. In: 2023 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2023, 12 December 2023 through 14 December 2023, Hybrid, Rose-Hill.
Sahoo, M and Gope, D (2020) NEXT FEXT Prediction using Hybrid 2D-3D Solver for Fast Electromagnetic Analysis. In: IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, 14-16 Dec 2020, Shenzhen, China.
Govindan, S and Bharath, K and Venkataraman, S and Gope, D (2020) A Large-Signal Method for Modeling Vccin feedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators. In: 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, 14-16 Dec 2020, Virtual, Shenzhen; China.
