Number of items: 2.
Conference Paper
Sahoo, M and Gope, D
(2020)
NEXT FEXT Prediction using Hybrid 2D-3D Solver for Fast Electromagnetic Analysis.
In: IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, 14-16 Dec 2020, Shenzhen, China.
Sahoo, M and Gope, D and Ambasana, N and Eesha, D and Chandrasekhar, A
(2019)
Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis.
In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, 6 October 2019 through 9 October 2019, McGill University CampusMontreal; Canada.
This list was generated on Sun Dec 22 00:30:47 2024 IST.
