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Nittala, PVK and Haridas, K and Sen, P (2022) Heterogeneous Integration by the 3D Stacking of Thin Silicon Die. In: 72nd IEEE Electronic Components and Technology Conference, ECTC 2022, 31 May - 3 June 2022, San Diego, pp. 608-613.
Nittala, PVK and Haridas, K and Nigam, S and Tasneem, S and Sen, P (2021) Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies. In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 39 (5).
Nittala, PVK and Remesh, N and Niranjan, S and Tasneem, S and Raghavan, S and Muralidharan, R and Nath, DN and Sen, P (2020) Enabling Transfer of Ultrathin Layers of GaN for Demonstration of a Heterogenous Stack on Copper Heat Spreader. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (2). pp. 339-342.
Nittala, PVK and Sahoo, K and Bhat, N and Bhat, KN and Sen, P (2019) Effect of substrate transfer on performance of vertically stacked ultrathin MOS devices. In: IEEE Transactions on Electron Devices, 66 (3). pp. 1153-1159.
