Number of items: 2.
Journal Article
Nittala, PVK and Haridas, K and Nigam, S and Tasneem, S and Sen, P
(2021)
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies.
In: Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics, 39
(5).
Ojha, SK and Hazra, S and Mandal, P and Patel, RK and Nigam, S and Kumar, S and Middey, S
(2021)
Electron Trapping and Detrapping in an Oxide Two-Dimensional Electron Gas: The Role of Ferroelastic Twin Walls.
In: Physical Review Applied, 15
(5).
This list was generated on Sun Dec 22 02:00:41 2024 IST.
