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Lavakumar, A and Hwang, S and Okada, K and Park, M-H and Chokshi, AH and Tsuji, N (2024) Real-time Observation of Stress-strain Behavior beyond Necking in Martensitic Steel by in-situ Synchrotron X-ray Diffraction. In: ISIJ International, 64 (12). pp. 1847-1852.
Bojjawar, G and Suwas, S and Chokshi, AH (2023) The Effect of Texture on the Hall-Petch Relationship in Severely Drawn Ni-Co Microwires. In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science .
Bojjawar, G and Suwas, S and Chokshi, AH (2022) Influence of Co content on the simultaneous enhancement of strength and ductility in severely drawn textured Ni-Co microwires. In: Philosophical Magazine Letters .
Arya, A and Suwas, S and Chokshi, AH (2022) Strengthening in tension and weakening in torsion in drawn nickel microwires. In: Materials Science and Engineering A, 856 .
Bapari, S and Ghosh, P and Lienert, U and Chokshi, AH (2020) A multi-scale deformation analysis for a particulate composite at the rigidity threshold. In: Composites Science and Technology, 191 .
Kini, MK and Chokshi, AH (2020) Initial stage sintering of polycrystalline spheres: A model and experiments. In: Materialia, 10 (100665).
Agepati, S and Ghosh, P and Chokshi, AH (2016) Microstructural evolution and strength variability in microwires. In: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 652 . pp. 239-249.
Shanmugasundaram, T and Bouzy, E and Chokshi, AH (2015) Strengthening and weakening by repeated dynamic impact in microcrystals and nanocrystals. In: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 639 . pp. 97-102.
Prasad, MJNV and Chokshi, AH (2012) Deformation-induced thermally activated grain growth in nanocrystalline nickel. In: SCRIPTA MATERIALIA, 67 (2). pp. 133-136.
Chokshi, AH (1999) Diffusion creep in ceramics. In: Proceedings of Creep Behavior of Advanced Materials for the 21st Century. TMS Annual Meeting, 28 Feb.-4 March 1999, San Deigo, CA, USA, pp. 461-470.