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Nitrogen rich PECVD silicon nitride for passivation of Si and AlGaN/GaN HEMT devices

Subhani, KN and Remesh, N and S, N and Raghavan, S and R, M and Nath, DN and Bhat, KN (2021) Nitrogen rich PECVD silicon nitride for passivation of Si and AlGaN/GaN HEMT devices. In: Solid-State Electronics, 186 .

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Official URL: https://doi.org/10.1016/j.sse.2021.108188

Abstract

In this work, we have investigated the material properties of PECVD (Plasma Enhanced Chemical Vapor Deposition) amorphous Silicon nitride (SiN) films and the influence of deposition conditions on gate-leakage increase of AlGaN/GaN HEMT's (High Electron Mobility Transistor) after passivation. We have studied the effect of gas flow ratio (SiH4/NH3) on the structural and compositional properties of SiNx deposited on crystalline Silicon (Si). Based on the inference, electrical properties of the SiNx films were examined by depositing on AlGaN/GaN HEMT as a passivation layer. The optimized SiNx which is N-rich with a refractive index of 1.83, tensile stress of 681 MPa and NH3/SiH4 ratio of 18 shows only a 1.2x variation in gate leakage, 1.4x increase in gm, minimum left shift of 0.03 V in Vth and 1.26x increase Ion/Ioff ratio after passivation. We believe that the 3x reduction in Si-H bonds resulting in reduced interface traps at SiN/AlGaN interface is the reason for the minimal increase in gate leakage after passivation. © 2021 Elsevier Ltd

Item Type: Journal Article
Publication: Solid-State Electronics
Publisher: Elsevier Ltd
Additional Information: The copyright for this article belongs to Elsevier Ltd
Keywords: Aluminum gallium nitride; Ammonia; Amorphous silicon; Electron mobility; Flow of gases; Gallium nitride; High electron mobility transistors; III-V semiconductors; Passivation; Plasma CVD; Plasma enhanced chemical vapor deposition; Refractive index, AlGaN/GaN high electron mobility transistor; AlGaN/GaN high electron mobility transistors; Amorphous silicon nitride; Compositional properties; Crystalline silicons; Deposition conditions; Gas-flow ratio; Gate-leakage; On-off ratio; Silicon Nitride Film, Silicon nitride
Department/Centre: Division of Interdisciplinary Sciences > Centre for Nano Science and Engineering
Date Deposited: 03 Dec 2021 08:44
Last Modified: 03 Dec 2021 08:44
URI: http://eprints.iisc.ac.in/id/eprint/70605

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