Application of Qualitative Imaging Methods to Electrical Performance-Aware Package Board Design

Ambasana, Nikita and Gope, Dipanjan and Chandrasekhar, Arun (2013) Application of Qualitative Imaging Methods to Electrical Performance-Aware Package Board Design. In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS, OCT 27-30, 2013, San Jose, CA, pp. 247-250.

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Abstract

Package-board co-design plays a crucial role in determining the performance of high-speed systems. Although there exist several commercial solutions for electromagnetic analysis and verification, lack of Computer Aided Design (CAD) tools for SI aware design and synthesis lead to longer design cycles and non-optimal package-board interconnect geometries. In this work, the functional similarities between package-board design and radio-frequency (RF) imaging are explored. Consequently, qualitative methods common to the imaging community, like Tikhonov Regularization (TR) and Landweber method are applied to solve multi-objective, multi-variable package design problems. In addition, a new hierarchical iterative piecewise linear algorithm is developed as a wrapper over LBP for an efficient solution in the design space.

Item Type:	Conference Proceedings
Series.:	IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
Additional Information:	Copyright for this article belongs to the IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA
Department/Centre:	Division of Electrical Sciences > Electrical Communication Engineering
Date Deposited:	13 Jan 2015 05:12
Last Modified:	13 Jan 2015 05:12
URI:	http://eprints.iisc.ac.in/id/eprint/50655

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