Chokshi, AH (2003) The influence of grain size on deformation of copper. In: Materials Science Forum, 426-4 . 4393-4398 .
Full text not available from this repository. (Request a copy)Abstract
It is well know that grain boundaries enhance strength at low temperatures by acting as obstacles to dislocation motion, and they retard strength at higher temperatures by processes involving grain boundary sliding. The available data on the influence of grain boundaries on deformation in copper is summarized. Equi-channel angular extrusion offers a convenient means for imposing severe plastic deformation to refine the grain size in bulk materials. Experimental data on fine grained copper produced by equi-channel angular extrusion will be described, and the implications of the data for diffusion creep and superplasticity will be discussed.
| Item Type: | Editorials/Short Communications |
|---|---|
| Publication: | Materials Science Forum |
| Publisher: | Trans Tech Publications Inc.. |
| Additional Information: | Copyright of this article belongs to Trans Tech Publications Inc.. |
| Keywords: | Diffusion Creep;Grain Boundary Sliding;Hall-Petch; Nanocrystalline;Superplasticity |
| Department/Centre: | Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy) |
| Date Deposited: | 25 Aug 2011 04:26 |
| Last Modified: | 25 Aug 2011 04:26 |
| URI: | http://eprints.iisc.ac.in/id/eprint/40273 |
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