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A general contact mechanical formulation of multilayered structures and its application to deconvolute thickness/mechanical properties of glue used in surface force apparatus

Math, Souvik and Horn, Roger and Jayaram, Vikram and Biswas, Sanjay K (2007) A general contact mechanical formulation of multilayered structures and its application to deconvolute thickness/mechanical properties of glue used in surface force apparatus. In: Journal of Colloid and Interface Science, 308 (2). pp. 551-561.

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Abstract

Currently data obtained from surface force apparatus experiments are convoluted with the mechanical response of glue of unknown thickness, used to bond mica sheets to the substrates. This paper describes a formulation to precisely deconvolute out the forces between the mica sheets by determining the thickness of glue, knowing the mechanical properties of the glue. The formulation consists of a general solution based on the noniterative Hankel transform of the Laplace equation. The generality is achieved by treating all the layers except the one in contact as an effective lumped system consisting of a set of springs in series, where each spring represents a layer. The solution is validated by nanoindentation of trilayer systems consisting of layers with widely diverse mechanical properties, some differing from each other by three orders of magnitude. SFA experiments are done with carefully metered slabs of glue. The proposed method is validated by comparing the actual glue thicknesses with those determined using the present analysis.

Item Type: Journal Article
Publication: Journal of Colloid and Interface Science
Publisher: Elsevier
Additional Information: Copyright of this article belongs to Elsevier.
Keywords: Trilayer;Effective modulus;Nanoindentation;Surface force apparatus
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Division of Mechanical Sciences > Mechanical Engineering
Date Deposited: 30 May 2008
Last Modified: 19 Sep 2010 04:45
URI: http://eprints.iisc.ac.in/id/eprint/14114

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