Grain boundary grooving in a polycrystalline thin film: A phase-field study

Mukherjee, R and Abinandanan, TA (2022) Grain boundary grooving in a polycrystalline thin film: A phase-field study. In: Computational Materials Science, 203 .

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Abstract

Surface diffusion controlled grain boundary grooving in a polycrystalline thin film is studied using a phase-field model. We validate our model by comparing the simulation results with the classical theory of Mullins and further study the systems with anisotropic interfaces and finite grain sizes. Steady state velocity for grain growth is observed in the former case when grooving becomes extremely slow. The temporal evolution of groove depth shows significant deviation from Mullins� theory in the latter case, due to overlap of groove profiles. We also extend the model in the third dimension to study pitting at grain vertices in a thin film with equal sized hexagonal grains. The results indicate that for a given film thickness there exists a critical grain size above which hole formation occurs due to pitting. © 2021 Elsevier B.V.

Item Type:	Journal Article
Publication:	Computational Materials Science
Publisher:	Elsevier B.V.
Additional Information:	The copyright for this article belongs to Elsevier B.V.
Keywords:	Grain boundaries; Grain growth; Grain size and shape, Grain boundary grooving; Grain boundary migrations; Interface diffusion; Mullins; Phase field models; Phase fields; Pittings; Polycrystalline thin film; Thermal grooving; Thin-films, Thin films
Department/Centre:	Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited:	06 Jan 2022 06:15
Last Modified:	06 Jan 2022 06:15
URI:	http://eprints.iisc.ac.in/id/eprint/70794

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