Dhami, HS and Panda, PR and Mohanty, DP and Udupa, A and Mann, JB and Viswanathan, K and Chandrasekar, S (2021) Unified Analysis of Temperature Fields Arising from Large Strain Deformation and Friction in Manufacturing Processes. In: 150th Annual Meeting and Exhibition of The Minerals, Metals and Materials Society, TMS 2021, 15-18 Mar 2021, Pittsburgh, pp. 921-931.
Full text not available from this repository.Abstract
We consider the contact between a sliding wedge/tool and a metal surface prototypical of material removal and deformation processing operations such as forming, cutting, and wear. We show how heat generated at the contact is partitioned into each of the bodies involved: tool, workpiece, removed chip, and surrounding fluid (if any). By performing thermal analysis and heat partition via temperature matching on global and local scales, we show how temperature fields in all four bodies can be easily calculated. The analysis framework involves a heat source moving over a body (Jaeger) and energy partition at the contact into tool, workpiece, fluid, and chip/wear particle (Blok). We present temperature solutions for two cases�incremental forming and grinding�while providing a simple method for solving the thermal problem in other deformation processing applications. © 2021, The Minerals, Metals & Materials Society.
| Item Type: | Conference Paper |
|---|---|
| Publication: | Minerals, Metals and Materials Series |
| Publisher: | Springer Science and Business Media Deutschland GmbH |
| Additional Information: | The copyright for this article belongs to Springer Science and Business Media Deutschland GmbH |
| Keywords: | Deformation; Metal cutting; Thermoanalysis, Analysis frameworks; Deformation processing; Energy partition; Incremental forming; Large strain deformation; Manufacturing process; Temperature matching; Unified analysis, Metal analysis |
| Department/Centre: | Division of Mechanical Sciences > Mechanical Engineering |
| Date Deposited: | 10 Aug 2021 06:16 |
| Last Modified: | 10 Aug 2021 06:16 |
| URI: | http://eprints.iisc.ac.in/id/eprint/69144 |
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