Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis

Sahoo, M and Gope, D and Ambasana, N and Eesha, D and Chandrasekhar, A (2019) Hybrid 2D-3D Fast Electromagnetic Analysis aided by Pattern Recognition for Signal Integrity Analysis. In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, 6 October 2019 through 9 October 2019, McGill University CampusMontreal; Canada.

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Abstract

The use of 3D full-wave electromagnetic solvers for signal integrity analysis is often hindered by its prohibitive time and memory requirements. In this work, a hybrid 2D-3D solver is proposed to address the computational challenges while still preserving the desired accuracy. The method is based on an image based segmentation technique followed by 2D-3D classification for each segment, analysis and cascading transfer functions. A figure of merit that accurately represents simulation accuracy in frequency domain is identified for the 2D-3D prescription. Numerical results for a 13 trace is presented and the benefit in simulation time versus accuracy are highlighted.

Item Type:	Conference Paper
Publication:	2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019
Publisher:	Institute of Electrical and Electronics Engineers Inc.
Additional Information:	cited By 0; Conference of 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 ; Conference Date: 6 October 2019 Through 9 October 2019; Conference Code:159504
Department/Centre:	Division of Electrical Sciences > Electrical Communication Engineering
Date Deposited:	01 Jul 2020 09:49
Last Modified:	01 Jul 2020 09:49
URI:	http://eprints.iisc.ac.in/id/eprint/65539

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