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Hot deformation behavior of the high-entropy alloy CoCuFeMnNi

Prasad, Natasha and Bibhanshu, Nitish and Nayan, Niraj and Avadhani, Ganesh S and Suwas, Satyam (2019) Hot deformation behavior of the high-entropy alloy CoCuFeMnNi. In: JOURNAL OF MATERIALS RESEARCH, 34 (5, SI). pp. 744-755.

Full text not available from this repository.
Official URL: https://doi.org/10.1557/jmr.2018.500


In the present study, hot deformation behavior of a FCC high-entropy alloy CoCuFeMnNi has been investigated to explore the stress-strain response for a wide range of temperatures and strain rates. The deformation response has been examined by plotting a processing map and examining the evolution of microstructure and texture in each of the temperature-strain rate domain. Hot compression tests were carried out in the temperature range 850-1050 degrees C at strain rates varying from 0.001 s(-1) to 10 s(-1). Stress-strain curves indicate characteristic softening behavior due to dynamic recrystallization (DRX). DRX has been observed along grain boundaries, shear bands, as well as in the interior of deformed grains. The size of dynamically recrystallized grains shows a strong dependence on deformation temperature and increases with temperature. A high degree of twin formation takes place in the DRX grains evolved inside the shear bands, and the extent of twinning decreases at high temperatures. The optimal processing window has been estimated based on strain rate sensitivity and has been validated with detailed analyses of microstructure and texture. The best region for thermo-mechanical processing has been identified as in the temperature range 850-950 degrees C at strain rate 10(-1) s-1.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to CAMBRIDGE UNIV PRESS
Keywords: high-entropy alloy; deformation behavior; strain rate sensitivity map; microstructure; texture; dynamic recrystallization
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 24 May 2019 09:09
Last Modified: 24 May 2019 09:09
URI: http://eprints.iisc.ac.in/id/eprint/62468

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