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Insight into the effect of Ti-addition on diffusion-controlled growth and texture of Nb 3 Sn intermetallic superconductor phase

Santra, S and Makineni, SK and Shankar, G and Suwas, S and Chattopadhyay, K and Divinski, SV and Paul, A (2019) Insight into the effect of Ti-addition on diffusion-controlled growth and texture of Nb 3 Sn intermetallic superconductor phase. In: Materialia, 6 .

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Abstract

The alloying of Ti with Cu(Sn) and Nb significantly increases the grain boundary diffusion-controlled growth kinetics of Nb 3 Sn accompanied with a decrease in the activation energy in the Cu(5.5 at. Sn, Ti)/Nb and Cu(5.5 at. Sn)/Nb(Ti) diffusion couples. In either case, the β-(Ti,Nb) precipitates form at the grain boundaries of Nb 3 Sn. On the other hand, the ternary intermetallic phase, Nb 3 Sn 2 Ti 3 , is present in the interior of the Nb 3 Sn phase matrix only when Ti is added to Nb. The pinning forces on the grain boundaries of Nb 3 Sn exhorted by the β-(Ti,Nb) precipitates and related microstructure refinement results in an enhanced growth kinetics of the product phase, Nb 3 Sn. The addition of 0.5 at. Ti to Cu(Sn) has a stronger influence on the growth kinetics and the activation energy for the growth of Nb 3 Sn compared to 3 at. Ti to Nb owing to a higher fraction of smaller and equiaxed grains with high angle grain boundaries of Nb 3 Sn. The Ti-free Nb 3 Sn phase layer grows with a weak texture, a commonly observed behavior in other material systems for the product phases grown by diffusion-controlled mechanism in the interdiffusion zone. On the contrary, a very strong crystallographic texture of the Ti-containing product phase, Nb 3 Sn, is reported that has a unique pattern depending on the orientation of the adjacent Nb or Nb(Ti) grains. The Cu atoms segregate to the grain boundaries of Nb 3 Sn over a distance of �2�5 nm with a depletion of Nb. © 2019

Item Type: Journal Article
Additional Information: cited By 0
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 26 Mar 2019 07:52
Last Modified: 26 Mar 2019 07:52
URI: http://eprints.iisc.ac.in/id/eprint/61988

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