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Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling

Kumar, Praveen and Koledov, Victor and von Gratowski, Svetlana and Pratap, Rudra and Irzhak, Artemy and Zhikharev, Alexey and Orlov, Andrey and Lega, Peter and Talukder, Santanu and Kumar, Sumit and Shashtri, Vijayendra (2018) Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling. In: IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), AUG 13-17, 2018, Hangzhou, PEOPLES R CHINA, pp. 167-170.

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Official URL: https://doi.org/10.1109/3M-NANO.2018.8552248

Abstract

In the report the physical basis of the development of electrical nano-contacts for bottom-up nanointegration are studied. For the fabrication of the electrical nano-contacts it is proposed to use the electromigration of micro - and -nano-drops of metals and 3D mechanical nanomanipulation of the nanowires. Nano-manipulation is provided by the usage of nanotweezers, produced from shape memory alloy composite. The process of the melting of the micro-wires was studied under the action of laser radiation and heating.

Item Type: Conference Proceedings
Additional Information: IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), Hangzhou, PEOPLES R CHINA, AUG 13-17, 2018
Keywords: electromigration; liquid-solid phase transition nano-jointing; nanowires; microdrops; nanodrops; nanomanipulation; ``bottom-up'' nanointegration; shape memory effect; nanotweezers
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Francis Jayakanth
Date Deposited: 07 Feb 2019 09:01
Last Modified: 07 Feb 2019 09:01
URI: http://eprints.iisc.ac.in/id/eprint/61674

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