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Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material

Sharma, Deepak and Jain, Aman and Somaiah, Nalla and Narayanan, P Ramesh and Kumar, Praveen (2018) Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material. In: JOURNAL OF ELECTRONIC MATERIALS, 47 (8). pp. 4863-4874.

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Official URL: https://dx.doi.org/10.1007/s11664-018-6355-x

Abstract

The effect of embedding Cu-graphene hybrid powder, namely ``graphene nano-sheet Cu'' (GNS-Cu) powder, into In-40 vol.% Cu solder alloy on the electrical and mechanical properties of In-Cu solder is investigated. GNS-Cu hybrid powders were prepared by mixing reduced graphene oxide powders and CuSO4 center dot 5H(2)O, followed by reduction of the mixture with hydrazine. Subsequently, In-Cu solders with GNS-Cu powders were prepared using a 2-step process, comprising liquid phase sintering (LPS) of In and Cu powders followed by accumulative roll bonding (ARB). During ARB, the GNS-Cu powders were embedded as distinct layers into In-Cu composite solders. Electrical conductivity of the GNS-Cu embedded solders increased by > 20% as compared to pure In-Cu solders processed through the same combination of LPS-ARB steps. The yield strength of In-Cu solder increased by only 10% with the addition of GNS-Cu powders and thus retained the moderate strength often associated with pure In-Cu composite solders. Moreover, the thermal conductivity of GNS-Cu-embedded solders was estimated theoretically to increase by > 60%. These promising findings suggest that GNS-Cu-embedded In-Cu solders can be suitable for next-generation metallic thermal interface material and package-level interconnect applications.

Item Type: Journal Article
Additional Information: Copyright of this article belong to SPRINGER, 233 SPRING ST, NEW YORK, NY 10013 USA
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Depositing User: Id for Latest eprints
Date Deposited: 23 Jul 2018 15:41
Last Modified: 23 Jul 2018 15:41
URI: http://eprints.iisc.ac.in/id/eprint/60273

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