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Effect of Microfabrication Induced Stresses on the Sensing Characteristics of Dynamic MEMS Devices

Pratap, R and Dangi, A and Behera, AR (2016) Effect of Microfabrication Induced Stresses on the Sensing Characteristics of Dynamic MEMS Devices. In: Symposium on Microfabricated and Nanofabricated Systems for MEMS/NEMS 12 held during the PRiME Joint International Meeting of The Electrochemical-Society, The Electrochemical-Society-of-Japan, and the Korean-Electrochemical-Society, OCT 02-07, 2016, Honolulu, HI, pp. 35-45.

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Official URL: http://doi.org/10.1149/07517.0035ecst

Abstract

Residual stresses play an important role in deciding the performance and reliability of MEMS devices. In this work, we present one study each of the compressive residual stress induced effects and the tensile residual stress induced effects on the dynamic behavior of MEMS structures. We find that compressive residual stresses can be introduced with reasonable control to obtain 1-D MEMS structures with desired degree of buckling. We also present a case of multilayered suspended plate structure where the presence of residual tensile stress causes the structure to transition from plate behavior to membrane behavior thus significantly changing the characteristics of the structure when used as a sensor. We also present the applicability of residual stress engineering and stress tuning to these MEMS structure.

Item Type: Conference Proceedings
Additional Information: Copy right for this article belongs to the ELECTROCHEMICAL SOC INC, 65 S MAIN ST, PENNINGTON, NJ 08534-2839 USA
Department/Centre: Division of Mechanical Sciences > Mechanical Engineering
Division of Interdisciplinary Research > Centre for Nano Science and Engineering
Depositing User: Id for Latest eprints
Date Deposited: 24 Aug 2017 07:02
Last Modified: 25 Feb 2019 10:58
URI: http://eprints.iisc.ac.in/id/eprint/57680

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